Dongseop Lee, an integrated master's/doctoral student in POSTECH's Department of Electrical Engineering advised by Professor Wonbin Hong, won the “1st Prize Best Antenna Measurement Paper Awards” at the 2024 IEEE International Symposium on Antennas and Propagation (ISAP) for “Streamlined Characterization Methodology for Chip-Level Antenna Performance: Electrical and Mechanical Analysis and Optimization.” This is the research group's first award at ISAP.

ISAP is the largest international IEEE Antennas and Propagation Society (IEEE AP-S) conference across the Asia-Pacific region. This year's event was held in Songdo, Incheon, Korea. A total of 516 papers were submitted to ISAP 2024. Following a rigorous three-stage review, Lee's paper placed first among six finalists.

The paper proposes a precise performance evaluation methodology through experiments analyzing the multiphysics electrical and mechanical characteristics of die shift and warpage in fan-out wafer-level package (FOWLP) antenna design, and validates the methodology experimentally.

The study earned first place for Best Antenna Measurement Paper in recognition of its originality, innovation, and potential impact on chip-level antenna packaging and electromagnetic applications.