Professor Rock-Hyun Baek of POSTECH’s Department of Electrical Engineering was invited to speak on December 11 in the “Leading Semiconductor Products and Advanced Packaging” focus session at the IEEE International Electron Devices Meeting (IEDM).

For this focus session, the organizing committee selects the year’s most prominent topics and invites suitable speakers recommended from around the world. NVIDIA, AMD, Qualcomm, POSTECH, TSMC, Intel, TEL, and IBM were invited, with POSTECH the only academic institution represented.

Through the presentation, Professor Baek’s team was recognized for using quantitative metrics and integrated analysis to present a roadmap for forksheet and complementary devices—cutting-edge logic technologies applicable to next-generation angstrom technology nodes beyond the nanoscale era—and three-dimensional wafer backside technologies.

Marking its 70th anniversary this year, IEDM is, alongside the Symposia on VLSI Technology and Circuits, one of the world’s most prestigious conferences in semiconductor devices and processes. It is held in San Francisco, USA, in early December each year.